R-Theta Thermal Solutions, Inc., has been a global leader for over 25 years in the design and manufacturing of innovative thermal management solutions serving a broad range of markets.
R-Theta’s powerful software “R-Tools” provides on-line thermal modeling if heat sinks for semiconductors in natural or forced convection for air cooled, as well as, liquid-cooled plates.
Standard products offered are heat sinks for board level IC’s, surface mount and thru-hole discrete semiconductor packages, extruded heat sinks, fabfin and aluminum extrusion profiles. Thermal interface materials include silicone and non-silicone thermal compounds, sil-pads, and adhesive tapes.
- Mixed Metals Fabfin
- Hollow Fin
- Heat Sink Extrusions
- Liquid Cooled Aquasinks
- Bonded Fin
- Custom Extrusions