Darrah Electric Company has developed a High Efficiency Hybrid Heatsink for Power Applications

Thursday, July 16, 2009
Traditionally High Power applications require an Extruded Heatsink that is capable of handling the both the current and the thermal requirements of the design. The Darrah hybrid Heatsink offers a unique approach. By using both an Aluminum Extrusion for Current carrying and Bonded Fin technology to meet the Thermal requirements we have engineered a highly efficient Heatsink. The new Darrah hybrid Heatsink was designed for 75mm through 125mm silicon chip sizes.
 
The design also offers localized fans for efficient cooling adding significant cost savings for complete designs.
 
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